ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,796, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of manufactur... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,797, issued on Oct. 6, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Package structure with protective... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,798, issued on Oct. 6, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor devices and methods of making semiconductor devic... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,799, issued on Oct. 6, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Diamond pixel array with offset memory" was invented by Harsh Jhave... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,800, issued on Oct. 6, was assigned to FORCE MOS TECHNOLOGY Co. LTD. (New Taipei City, Taiwan). "Method of making a multi-chip package devic... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,801, issued on Oct. 6, was assigned to Intel Corp. (Santa Clara, Calif.). "Copper rings for BGA count reduction in small form factor package... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,802, issued on Oct. 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method of fo... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,803, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor packages having dummy posts" was... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,804, issued on Oct. 6, was assigned to STMicroelectronics S.r.l. (Agrate Brianza, Italy). "Semiconductor device and corresponding method" wa... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,805, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package comprising redistributio... Read More